However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

Once he has the solder paste on, he places the components ... [Colin] uses a microscope to do some inspection of the board, although the BGA could have concealed faults that would be hard to ...

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At the heart of these systems are ball grid arrays (BGAs)—the tiny solder joints that provide the electrical and mechanical connections essential for smooth operation (see Figure 1). While they may be ...

In the electronics and semiconductor industry, soldering connections with ball grid arrays (BGAs) is often used, most prominently to mount microprocessors. This report describes how a 3D inspection ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

Because nitrogen is not an oxidizing gas, adding it to the SMT convection reflow oven reduces oxidation on the welding ...

This means that I'm now confident about soldering 0402 passives, 0.8mm BGAs, QFNs with ground pads, and so on. (I have also soldered 0201s and 01005s as a confidence-building exercise.) I have a ...

This inspection checks the BGA soldering and so extracts 3D images of just the solder connection. Void inspection performance boosted by 3D X-Ray CT image processing Enhanced void inspections mitigate ...