Electronic devices have become smaller and more efficient while energy density has increased. How are manufacturers ...

Any thoughts on how to heat sink such a small part? It would have to be a heat sink to the case, as the junction to board thermal resistance is 30-40 C/W. Lowering the capacitive load should reduce ...

Heat Sink,Thermal Resistance,Channel Design,Computational Domain,Convective Heat,Fluid Solid Interface,Heat Flux,Heat Transfer,Numerical Simulations,Temperature ...

Electronic System,Fin Base,Heat Dissipation,Heat Sink,Heat Transfer,Heat Transfer Rate,Thermal Behavior,Thermal Conductivity,Thermal Radiation,Thermal Resistance,Bottom Of Page,Chebyshev ...

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, either between components or within a finished product. Thermally conductive resins, tapes, ...

The thinner substrate significantly reduces thermal resistance to further help heat transfer away to the heat sink. Secondly, the lower pressure required for this process means that the ...