本稿はMemory編だ。 関連記事リンク (2025年1月1日掲載) PCテクノロジートレンド 2025 - プロセス編「TSMC」 (2025年1月2日掲載) PCテクノロジー ...
薄型にできるLPDDRの利点を生かしたまま交換可能にする方法として、CAMM2という規格が立ち上がっています。この規格は、LPDDRのはんだ直結(BGAソケット)を、全てピンと接点に置き換えLGAソケットにしてしまえばいい、というものです。
This paper represents a generic executable architecture. It represents the efficient behaviour of the Memory Model to be used for verification of SOC communicating with DDR SDRAMs or can be used as ...
Most computer standards change quickly, with manufacturers adopting new ports, cables, and form factors as soon as they ...
SanDisk, Kioxia, SK hynix, Micron, Samsung and Macronix were showing their storage and memory solutions at the 2025 CES.
When you buy through links on our articles, Future and its syndication partners may earn a commission.
DDR5 enables higher-density modules, with capacities up to four times greater per module than DDR4 and supports faster ...
When you buy through links on our articles, Future and its syndication partners may earn a commission.
G.SKILL, the popular high-performance memory chip maker, has just introduced its new DDR5-6400 CL30 memory kits.