Abstract: Semiflexible polyimide structures are not amenable to good adhesion because of their a) spontaneous orientation of the polymer chains parallel to the film substrate during curing, b) ...

Recent research has focused on enhancing the properties of polyimide films, particularly their dielectric performance, optical transparency, and thermal stability, to meet the evolving demands of ...

Abstract: In this paper we describe the effect of oxygen-reactive ion-beam etching of a polyimide film to enhance its adhesion to an overlying, subsequently deposited copper film. The adhesion ...

Polyimide resins are popular for manufacturing microelectronic equipment for a variety of electronic applications. These polymers have superior dielectric properties, provide thermal stability and ...